1/4 rev. c structure silicon monolithic integrated circuit product name power supply for ccd camera / white led driver / rgb led driver of mobile phone type BD6023AGU features a system power supply for the ccd camera module built-in white led driver for the lcd back light and rgb led driver absolute maximum ratings (ta=25 o c) parameter symbol rating unit condition maximum applied voltage 1 vmax1 20(*1) v maximum applied voltage 2 vmax2 16(*2) v maximum applied voltage 3 vmax3 15(*3) v maximum applied voltage 4 vmax4 -13.5(*4) v maximum applied voltage 5 vmax5 6(*5) v power dissipation pd 2500(*6) mw operating temperature range topr -30 to 85 o c storage temperature range tstg -55 to 150 o c (*1) vplus11, vplus12, vplus2 pin (*2) camp pin (*3) ledr, ledg, ledb, bkled, fled1, fled2 pin (*4) vneg11, vneg12, camn pin (*5) except *1~ *4 pin (*6) power dissipation deleting is 20mw/ o c, when it?s used in over 25 o c. it?s deleting is on the bo ard that is rohm?s standard. recommended operating conditions (ta=-30 to 85 o c) parameter symbol rating unit condition min. typ. max. vbat power supply voltage vbat 2.7 3.6 4.5 v vio power supply voltage vio 1.62 3.0 3.3 v this product isn?t designed to protect itself against radioactive rays.
2/4 rev. c electrical characteristics unless otherwise specified, ta=25 o c, vbat=3.6v, vio=1.8v/3.0v, vcc=2.45v parameter symbol spec unit condition min. typ. max. circuit current vbat circuit current 1 iq1 - 0.5 3.0 a rstb=0v vbat circuit current 2 iq2 - 0.1 3.0 a rstb=0v, vio=0v vbat circuit current 3 iq3 - 6.2 9.3 a regvcc on (energy save mode) vbat circuit current 5 iq5 - 11 16 a regvcc on (energy save mode) reg1 on (energy save mode) reg2 on (energy save mode) vbat circuit current 8 iq8 - 26 39 ma regvcc on (normal mode) swreg1 on (vo=14v, io=1ma) swreg3 on (vo=-10v, io=1ma) (add 30h=01h, add 80h=01h) regcp on, regcn on swreg1 (dc/dc for white led and power supply for camera ) fled1 drive current 3 i fled13 27.0 30.0 33.0 ma add=80h data=1eh fled2 drive current 3 i fled23 27.0 30.0 33.0 ma add=80h data=3eh bkled drive current 3 i bkled3 27.0 30.0 33.0 ma add=90h data=1eh swreg2 (dc/dc for rgb led ) ledr drive current ( large current) i ledr22 135 150 165 ma add=a0h data=0ch add=50h data=1eh ledg drive current ( large current) i ledg22 135 150 165 ma add=a0h data=0ah add=60h data=1eh ledb drive current ( large current) i ledb22 135 150 165 ma add=a0h data=09h add=70h data=1eh regcp (15v/13v ldo) output voltage 1 vo 151 14.5 15.0 15.5 v io=60ma, regcpvsel=0, vplus12=16v output voltage 2 vo 152 12.5 13.0 13.5 v io=60ma, regcpvsel=1, vplus12=14v regcn (-8v/-7.5/-7v ldo) output voltage 1 vo81 -8.5 -8.0 -7.5 v io=100ma, vneg12=-10v regcnvsel1=0, regcnvsel2=0 output voltage 2 vo82 -8.0 -7.5 -7.0 v io=100ma, vneg12=-10v regcnvsel1=1/0, regcnvsel2=1 output voltage 3 vo83 -7.5 -7.0 -6.5 v io=100ma, vneg12=-9v regcnvsel1=1, regcnvsel2=0 constant current drive cursens pin control voltage 3 i cur3 0.57 0.60 0.63 v add=e0h, data=ffh reg1 (3.0v/3.1v ldo) output voltage 1 vo11 2.94 3.00 3.06 v io=150ma, reg1vsel=0, reg1md=1 output voltage 2 vo12 3.04 3.10 3.16 v io=150ma, reg1vsel=1, reg1md=1 reg2 (1.8v/2.5v ldo) output voltage 1 vo21 1.74 1.80 1.86 v io=100ma, reg2vsel=l, reg2md=1 output voltage 2 vo22 2.45 2.50 2.55 v io=100ma, reg2vsel=h, reg2md=1
3/4 rev. c external dimensions terminals pin pin name pin pin name pin pin name a1 t1 c9 testo j1 vio a2 gnd2 c10 reg2o j2 testi a3 vbat1 d1 reg1cnt j3 reg2vsel a4 ledr d2 reg2cnt j4 vcc a5 gnd3 d9 vbat3 j5 fled2 a6 ledb d10 vbat4 j6 fled1 a7 camn e1 cur j7 trsw1 a8 gnd5 e2 cursens j8 sensp1 a9 camp e9 iref j9 sensn1 a10 t2 e10 reg1o j10 gnd8 b1 vplus2 f1 ledctl k1 t4 b2 gnd1 f2 regvcccnt k2 gnd11 b3 vbat2 f9 sensp3 k3 vbat8 b4 trsw2 f10 vref k4 bkled b5 ledg g1 rstb k5 gnd10 b6 gnd4 g2 clk k6 vbat7 b7 vneg12 g9 vbat5 k7 gnd9 b8 gnd6 g10 vbat6 k8 vplus11 b9 gnd7 h1 data k9 sensn3 b10 vplus12 h2 strb k10 t3 c1 sensn2 h9 vneg11 - - c2 sensp2 h10 trsw3 - - vcsp85h5 (64pin) (unit : mm) block diagram lot no. bd6023gu a type vio camn vplus12 camp reg2vsel reg2cnt data strb rstb testi t1 t2 t3 t4 reg1o reg2o vcc trsw1 sensp1 sensn1 reg1cnt bkled fled1 fled2 trsw2 ledr ledg ledb sensn2 sensp2 vplus2 ledctl vref iref testo vbat1 8 gnd1 11 cursens cur vneg12 vneg11 sensp3 trsw3 sensn3 vplus11 regvcccnt clk ldo 15v/13v regcp reg1 reg2 ldo 1.8v/2.5v ldo 3.0v/3.1v ldo -8v/-7.5v/-7v regcn cpu i/f cpu i/f 8bit dac sel sel level shift control logic ldo 2.45v reference voltage reference current vref iref osc osc + - + - + + + - - + - - - + - + - + - + pwm comp current limiter over voltage det err amp swreg2 cpu i/f cpu i/f power supply osc + - + - + - swreg3 swreg1 current limiter over voltage det err amp driver driver driver pwm com p err amp over voltage det current limiter vplus12 vneg12 pwm comp
4/4 rev. c cautions on use (1) absolute maximum ratings an excess in the absolute maximum rati ngs, such as supply voltage, temperatur e range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) power supply and gnd line design pcb pattern to provide low impedance for the wi ring between the power supply and the gnd lines. pay attention to the interference by common impedance of layout pattern when there are plural power supplies and gnd lines. especially, when there are gnd pattern for sm all signal and gnd pattern for large current included the external circuits, please separate each gnd pattern. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (4) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (5) operation in str ong electromagnetic field be noted that using ics in the strong el ectromagnetic field can malfunction them. (6) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thor ough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electric al characteristics. (7) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (8) thermal shutdown circuit (tsd) this lsi builds in a thermal shutdown (tsd) circuit. w hen junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from therma l runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not continu ously use the lsi with this circuit operating or use the lsi assuming its operation. (9) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (10) ldo use each output of ldo by the independence. don?t use under the condition that each output is short-circuited because it has the possibility t hat a operation becomes unstable. (11) dc/dc converter please select the low dcr inductors to decrease power loss for dc/dc converter. (12) other cautions on use please consult supplementary documents such as technica l notebook, function manual and application design guide of this lsi.
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